G.Skill’s preparing new Trident Z5 NEO and Flare X5 DDR5 modules that are ready for AMD’s Zen 4 processors 

G.Skill has prepared several new series’ of DDR5 memory kits that are ready for AMD’s new Ryzen 7000 series processors and AM5 motherboard platform. These new DRAM kits will be available in Flare X5 and Trident Z5 Neo flavours with speeds of up to DDR5-6000 with AMD EXPO compatibility (more information about AMD EXPO here).

The fastest of G.Skill’s new AMD compatible memory kits will be their DDR5-6000 Trident Z5 Neo RGB memory kit with CL 30-38-38-96 timings. This kit will be available with 2x16GB DRAM modules, though a larger capacity DDR5 2x32GB memory kit is also available with slightly slacker CL30-40-40-96 memory timings.

AMD’s EXPO technology is designed to allow Ryzen users to easily overclock their DDR5 memory kits to achieve optimal performance from their systems. PC builders can simply enable AMD EXPO profiles in the BIOS with a compatible CPU/motherboard to unleash the potential of their systems with minimal faffing about. 

G.Skill’s Ryzen/EXPO optimised DDR5 memory kits will be available this September, allowing PC enthusiasts to purchase them alongside AMD’s Ryzen 7000 series Zen 4 processors and AM5 motherboards. Below is G.Skill’s Press Release for their new EXPO compliant memory modules. 

Press Release – G.SKILL Announces Trident Z5 Neo & Flare X5 Series DDR5 Memory, Designed for AMD Ryzen 7000 Series Processors

G.SKILL International Enterprise Co., Ltd., the world’s leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

“We are thrilled to partner with G.SKILL to bring AMD EXPO technology to enthusiasts, gamers, and overclockers worldwide,” said David McAfee, Corporate Vice President and General Manager, Client Channel Business Unit, AMD. “AMD EXPO technology gives users piece of mind when selecting memory, unlocking improved memory performance with the click of a button.”

Bearing the flagship Trident family name, the new Trident Z5 Neo and Trident Z5 Neo RGB series are purpose built for overclock performance on the latest platform with AMD Ryzen 7000 Series processors. The heatspreader design retains the iconic powder-coated matte black and paired with a premium black brushed aluminium inset, which color-matches with a majority of motherboard color schemes. Staying true to the Neo design, CNC highlight strips along the flanks give the heatspreader design an additional metallic sheen.

Flare X5 – DDR5 for AM5

Available in a matte black finish, the Flare X5 series DDR5 memory is the successor of the Flare X series DDR4 memory. Built with hand-screened IC chips tested for quality and performance, the Flare X5 is designed and optimized for the new DDR5-enabled AM5 platform. Additionally, the 33 mm low-profile height of the Flare X5 also makes this an excellent choice for compact builds or builds with large CPU coolers that don’t have clearance height for taller memory modules.

Specifications & Availability

The Trident Z5 Neo, Trident Z5 Neo RGB, and Flare X5 series DDR5 memory kits will be available in September 2022 via G.SKILL worldwide distribution partners. Please refer to the table below for a list of specifications.

By FYIPC

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