G.Skill is preparing DDR5 memory versions that use AMD EXPO technology. EXPO, a competitor to Intel XMP 3.0, makes it simple to use overclockable RAM with AMD-compatible settings. It is activated with a single click in the motherboard’s UEFI configuration application.
This Trident Z5 memory package is the first to include AMD EXPO technology (EXtended Profiles for Overclocking). This week, board partners revealed that AMD X670E motherboards will enable Intel XMP 3.0 or AMD EXPO. AMD has not confirmed anything, but EXPO leaks have been out for quite some time (at least since April this year). Some companies verified EXPO as a Ryzen 7000-only memory overclocking feature. This method allows for either low-latency or high-bandwidth overclocking. DDR5-6000 will be the “sweet spot” memory frequency for the Ryzen 7000 “Raphael,” much like DDR4-3600 is for the Ryzen 5000 “Vermeer,” because it allows you to run the FClk at its highest possible frequency—3000 MHz in the case of Raphael and 1800 MHz in the case of Vermeer—without engaging a 1:2 divider between FClk and memory clock.
G.Skill Spear Z5 memory with the version number “F5-6000J3038F16G” attributes CL30-38-38-96 timing and a transmission capacity of 6000 MT/s. Reduced timings are seen in G.Skill kits for Intel systems with XMP profiles with CL-30-40-40-96 timings. The AMD Ryzen 7000’s “pleasant spot” may be 6000 MT/s rate. AMD will likely release Ryzen 7000 CPUs and X670 motherboards on September 15.